MEMS stands for Micro-Electro-Mechanical Systems. These are tiny devices — often a few square mm in size — that combine miniature mechanical components with electronics. At Myvox, we use PZT MEMS to create air-displacing actuators to move air with extreme precision, creating outputs such as high-performance air-flow based cooling and sound generation in ultra-compact formats. Unlike traditional microfans and microspeakers, our MEMS-based solutions are solid-state, ultra-thin, scalable, and integration-friendly — enabling higher performance and opening up new frontiers in design for tomorrow’s devices.

Myvox develops patented air-displacing MEMS technology, enabling solid-state actuators that directly move air using piezoelectric membranes—without coils, magnets, or traditional mechanics. Unlike conventional approaches, our silicon-based products are manufactured using highly scalable semiconductor processes, making it ideal for next-generation audio and cooling components. We offer leading performance, smaller form factor and lower price points.

Behind the technology is a team with extensive MEMS know-how and experience, including advanced research, industrial product development, high-volume fabrication/deliveries, and creation of several successful MEMS companies. Furthermore, Myvox’ main production partner is Sweden-based Silex Microsystems, the world-leading MEMS foundry. The result: a uniquely robust technology platform and performance-leading applications ready for volume deliveries to demanding customers world-wide.

Yes! Our chips are produced using mature, scalable semiconductor processes and are compatible with SMT (Surface-Mount Technology) assembly. Myvox partners with leading fabs and packaging providers to ensure quality, consistency, and production-readiness. Our primary production partner is Sweden-based Silex Microsystems, the world-leading MEMS foundry.

Traditional fans and speakers use a number of mechanical parts to create one-directional airflow or sound waves. At Myvox, we use MEMS chips with built-in actuators to move air directly at the micro level. This solid-state approach allows us to produce cooling airflows or audible sound from a silicon chip—compact, durable, and digitally controlled. Most importantly, we can offer higher performance, smaller form factors and lower cost.